LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 is a halogen-free solder paste for medium & large circuit board assemblies. It is designed to withstand the thermal demands that accompany larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications. LOCTITE HF 212 is truly Halogen Free
  • Meets all current “Halogen-free” restrictions
  • No added Halogen
  • Halide-free: ROL0 classification in accordance to j-STD-004B
  • Compatible with existing halogen-free solutions
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Ease of Application Excellent wetting capabilities Technology Printing and Reflow Advantages Wide process window for printing and minimal slump Fine pitch capability and reduction in solder bridging Excellent abandon time and stencil life Excellent humidity resistance Excellent solderability on challenging surface finishes (includes CuNiZn and Copper OSP) Improves fine pitch coalescence Low Voiding In CSP On industry surface finishes: ENIG, Copper OSP, CuNiZn and Imm Ag Increases solder joint reliability Options and Configurations
    • Alloy: 90iSC, SAC0307, SAC305, SAC387
    • Particle Size: Type 3, 4, 4.5 (4A), 5
    • Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582
    • Halogen-free flux classification: ROL0 to ANSI/J-STD-.004 Rev. B
    • Printing: Fine pitch capability (0.3 mm), stencil life (>8 hours), and abandon time (>4 hours)
    • Printing: suitable for high-speed printing up to 150 mm/s
    • Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP)
    • Colorless residues for easy post-reflow inspection

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