Loctite GC 10 - The Game Changer

Henkel LOCTITE GC 10,The Game Changer defies the way you ship, store and handle solder paste and offers game changing performance capabilities. LOCTITE GC 10 solder paste is a halogen free, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a range of temperature conditions. The enhanced paste stability created through its novel formulation strategy, increases both field application yields and on-line paste utilization. LOCTITE GC 10 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes and component metallizations including immersion Ag, OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome industry wide HiP and NWO challenges. The new flux chemistry will protect the solder longer, improve coalescence and optimize wetting performance, allowing for very shiny solder joints. LOCTITE GC 10 is suitable for use with industry standard SAC alloys.

No refrigeration, Improved stability, Improved printing, Improved reflow

Loctite GC 10 "The Game Changer

FEATURES AND BENEFITS

• Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582
• Halogen-free flux classification: ROL0 to ANSI/J-STD-004 Rev.B
• Printing: Fine pitch capability (0.3 mm), stencil life (>16 hours), and abandon time (>8 hours)
• Improved paste transfer efficiency
• Printing: Suitable for high speed printing up to 125 mms-1
• Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting
• Very shiny Pb-free solder joints over wide range of reflow
• Colorless residues for easy post-reflow inspection
• Residues pint-testable after 5x reflow
• Will allow online paste utilization protocols to be re-written

Compare Performance

Technical Information